chipflow.packaging.grid_array
=============================

.. py:module:: chipflow.packaging.grid_array

.. autoapi-nested-parse::

   Grid array package definitions.

   This module provides package definitions for grid array packages
   like BGA (Ball Grid Array) and PGA (Pin Grid Array) types.



Classes
-------

.. autoapisummary::

   chipflow.packaging.grid_array.GAPin
   chipflow.packaging.grid_array.GALayout
   chipflow.packaging.grid_array.GAPackageDef


Module Contents
---------------

.. py:class:: GAPin

   Bases: :py:obj:`NamedTuple`


   Pin identifier for grid array packages (row letter, column number)


.. py:class:: GALayout

   Bases: :py:obj:`enum.StrEnum`


   Layout type for grid array packages


.. py:class:: GAPackageDef

   Bases: :py:obj:`chipflow.packaging.base.BasePackageDef`\ [\ :py:obj:`GAPin`\ ]


   Definition of a grid array package.

   Pins or pads are arranged in a regular array of 'width' by 'height'.
   Pins are identified by a 2-tuple of (row, column), counting from
   the bottom left when looking at the underside of the package.
   Rows are identified by letter (A-Z), columns by number.

   The grid may be complete or have missing pins (e.g., center cutout).

   This includes many package types:

   - CPGA: Ceramic Pin Grid Array
   - OPGA: Organic Pin Grid Array
   - SPGA: Staggered Pin Grid Array
   - CABGA: Chip Array Ball Grid Array
   - CBGA/PBGA: Ceramic/Plastic Ball Grid Array
   - CTBGA: Thin Chip Array Ball Grid Array
   - CVBGA: Very Thin Chip Array Ball Grid Array
   - DSBGA: Die-Size Ball Grid Array
   - FBGA: Fine Ball Grid Array / Fine Pitch Ball Grid Array
   - FCmBGA: Flip Chip Molded Ball Grid Array
   - LBGA: Low-Profile Ball Grid Array
   - LFBGA: Low-Profile Fine-Pitch Ball Grid Array
   - MBGA: Micro Ball Grid Array
   - MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array
   - nFBGA: New Fine Ball Grid Array
   - SuperBGA (SBGA): Super Ball Grid Array
   - TABGA: Tape Array BGA
   - TBGA: Thin BGA
   - TEPBGA: Thermally Enhanced Plastic Ball Grid Array
   - TFBGA: Thin and Fine Ball Grid Array
   - UFBGA/UBGA: Ultra Fine Ball Grid Array
   - VFBGA: Very Fine Pitch Ball Grid Array
   - WFBGA: Very Very Thin Profile Fine Pitch Ball Grid Array
   - wWLB: Embedded Wafer Level Ball Grid Array

   Attributes:
       width: Number of columns
       height: Number of rows
       layout_type: Pin layout configuration
       channel_width: For PERIMETER/CHANNEL/ISLAND layouts
       island_width: For ISLAND layout, size of center island
       missing_pins: Specific pins to exclude (overrides layout)
       additional_pins: Specific pins to add (overrides layout)


   .. py:method:: model_post_init(__context)

      Initialize pin ordering



   .. py:property:: bringup_pins
      :type: chipflow.packaging.pins.BringupPins


      Bringup pins for grid array package


   .. py:property:: heartbeat
      :type: Dict[int, GAPin]


      Numbered set of heartbeat pins for the package