chipflow.packaging.standard

Standard package definitions for common package types.

This module provides concrete package definitions for: - Quad packages (QFN, LQFP, TQFP, etc.) - Bare die packages

Classes

`BareDiePackageDef`	Definition of a package with pins on four sides.
`QuadPackageDef`	Definition of a quad flat package.

class chipflow.packaging.standard.BareDiePackageDef

Definition of a package with pins on four sides.

Sides are labeled north, south, east, west with an integer identifier within each side, indicating pads across or down from top-left corner.

This is typically used for direct die attach without traditional packaging.

Attributes:: width: Number of die pads on top and bottom sides height: Number of die pads on left and right sides

Bringup pins for bare die package

class chipflow.packaging.standard.QuadPackageDef

Definition of a quad flat package.

A package with ‘width’ pins on the top and bottom and ‘height’ pins on the left and right. Pins are numbered anti-clockwise from the top left pin.

This includes many common package types:

Attributes:: width: The number of pins across on the top and bottom edges height: The number of pins high on the left and right edges

Bringup pins for quad package